grain structure Articles
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Microstructural investigation of through–silicon via fabrication by pulse–reverse electroplating for high density nanoelectronics
In this paper, fabrication of through–silicon vias (TSV) with different diameters ranging from 60 μm to 150 μm is reported. It was observed that at the low current density of 20 mA/cm², all the through–holes with different diameters are filled with copper without voids and pores. At higher current density of 40 mA/cm², however, the pillars with diameters bigger than 100 μm tend to have voids at ...
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What are the supporting equipment of granular organic fertilizer production line?
The granular organic fertilizer production line includes automatic conveyor, trough compost turning machine, drum screening machine, vertical pulverizer, extrusion granulator, cooler and automatic packaging machine. 1. Automatic conveyor: belt transmission, automatic feeding, prevent wall sticking; 2. Trough type compost turning machine: aerobic fermentation, multi-purpose, crushing materials; 3. ...
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