12 products found
Meyer Burger Products
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Competences- Cutting / Slicing -PV Mono -Cropping
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Model TS 207 Series - Inner Diameter Saw
Best cutting quality WITH minimum kerf loss for PV and semiconductor industrIES. Our inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Robust construction and easy handling are additional features of the TS 207. The machine is loaded manually with silicon ingots or bricks and offers flexibility of ...
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Semiconductor- Cropping & Wafering
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Model TS 207 - Inner Diameter Saw
The inner diameter saw TS 207 / 08 series crops mono-crystalline silicon ingots. During cropping the position of a cut on the ingot may be adjusted flexibly to guarantee highest yield. Test-wafers can be cut to thicknesses of 0.8 – 25 mm. Loading and unloading of the ingots can be done manually as well as ...
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Model DS 261 - Wire Saw
The first-class surface of the wafers, as well as best warp and TTV values, make the DS 261 the leading wire saw in the semi-conductor industry. The DS 261 yields top technological and qualitative performances and is used in particular for cutting 12 inch ...
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Semiconductor- Coating
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IonSys - Model 500 - Ion Beam Deposition System
The affordable IonSys 500 system is used for ion beam etching in research and development as well as in low volume production. The machine can be loaded manually or via a single-substrate load-lock. The handling can be configured for standard wafers or for standardized carriers for processing different sample ...
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IonSys - Model 800 - Ion Beam Deposition System
The IonSys 800 system is designed for industrial ion beam etching and deposition processes with maximum quality and productivity requirements. The combination of multi-layer etching and deposition in one tool is possible. The reliability, uptime and compatibility with clean room class 100 compliance with all the requirements for advanced production equipment in microelectronics and optics. The advanced IonSys 800 can also be configured as a cluster ...
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Competences-Cutting / Slicing-PV Mono-Glueing
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GlueMaster- Gluing Station
The GlueMaster is an independent gluing station available in five configuration levels/expansion stages. The GlueMaster 1 offers an adjustable mixing and dosing unit to apply the glue onto the workpiece holder, glass beam and bricks. Compared to manual glueing, this process saves in average 50 per cent of the ...
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Competences - Cutting / Slicing -PV Mono
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Model TS 207 - Inner Diameter Saw
Best cutting quality WITH minimum kerf loss for PV and semiconductor industrIES. Our inner diameter saw TS 207 combines best cutting quality with minimum kerf loss. Robust construction and easy handling are additional features of the TS 207. The machine is loaded manually with silicon ingots or bricks and offers flexibility of ...
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Photovoltaic
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MB - Model DW288 Series 3 - Wire Saw - Mastering Diamond Wire Technology
With the DW288, the high speed and precision of diamond wire technology are a matter of course. The prizewinning DW288 is specially designed for the production of mono and multicrystalline wafers, and can be operated with both diamond wire technology or slurry. It is also intended for high output with extremely thin diamond wires, and works at highest ...
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BrickMaster - Model BM 860 - Photovoltaic System
The BM 860 is the latest generation of bricking solutions based on Meyer Burger’s wire saw technology. The BrickMaster BM 860 is designed both for the G6 format (1,000 x 1,000 mm) as well as 6" and 8" mono c-Si. Output is doubled through the use of diamond wire instead of slurry. The G6 format brings a further increase in output of up to 40% (multi ...
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Meyer Burger - Model DW 291 - Smart Slicing Technology for Mono- and Multi-Silicon
DW 291 is designed for slicing mono- and multicrystalline silicon wafers for the photovoltaic industry. New DW 291 sets industry standards for fastest wafer cutting times. DW 291 delivers a comprehensive set of innovations to further increase wafer output. The patented Diamond Wire Management System (DWMS) ensures a longer service life thanks to resharpening technology and extended winding ...
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FABiA - Model 4.1 - Three Deposition Processes
Three deposition processes in a single piece of equipment. FABiA® 4.1 now incorporates PERC benefits and proven SiNA® and MAiA® features in a single tool. FABiA® is ideally suited to new PERx cell production lines. FABiA® stands out for its versatile, customizable modules and for deposition processes at lowest OPEX. Deposition of various dielectric layers guarantees future-proof ...
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HELiA - Coating Systems for Highest Efficiency Solar Cell
HELiA is the very latest generation of highly efficient cell coating, known as heterojunction. The core components for the manufacturing of solar cells using heterojunction technology (HJT) are HELiAPECVD and PVD. The systems are perfectly coordinated, both technologically and with regard to their total throughput of 2,400 wafers per ...