Epoxy Technology, Inc.

B9126-8 - Brochure

Document No. 43 Rev. D Product Information Sheet MATERIAL ID: EPO-TEKĀ® B9126-8 Date: Apr 2010 Per: Rev: II Material Description: A single component, thermally and electrically conductive, epoxy adhesive designed for semiconductor die attach and circuit assembly applications. Its unique features are a pot-life of several days, low ...