Meyer Burger

Model TS 207 - Inner Diameter Saw- Brochure

The inner diameter saw TS 207 / 08 series crops mono-crystalline silicon ingots. During cropping the position of a cut on the ingot may be adjusted flexibly to guarantee highest yield. Test-wafers can be cut to thicknesses of 0.8 – 25 mm. Loading and unloading of the ingots can be done manually as well as semi-automatically.