Thermo Scientific - Model Meridian S - Inverted Static Optical Fault Isolation System
The Thermo Scientific Meridian S Inverted Static Optical Fault Isolation System enables Failure Analysis engineers in fabs and service labs to localize electrical faults in semiconductor devices. It offers high-sensitivity Static Laser Stimulation (IR-OBIRCH) and Photon Emission capabilities for the identification of electrical shorts and areas of leakage, in addition to the characterization of device activity via non-destructive analysis. The Meridian S System was designed for upgradability to higher sensitivity Photon Emission and Dynamic OFI techniques to maximize value and productivity.
Key Benefits:
Building on the long-standing success of the Meridian family, the next-generation Meridian S Inverted Static Optical Fault Isolation System enables localization of electrical fault root causes.
FDx with Active Probe
- Next-gen static laser stimulation (SLS) amplifier for applications such as OBIRCH
- Higher sensitivity: picoamp level detectability
- Broader application space: expanded Forced Voltage and Forced Current ranges
- 4-Quadrant operability with the capability to run OBIRCH applications at positive and negative current and voltage
- New noise-cancellation architectures
- Proprietary Active Probe architecture for enhanced low-ohmic fault detection
- Lock-In capability supported across the entire SLS operation range up to 100 kHz
New probing architectures
- Static OFI analysis on a broad range of device architectures and package types
- Top-side micro-probing for flip chip packages and wafer pieces
- Backside micro-probing for conventionally packaged devices
- Dual-side probe card setup option enables electrical stimulation by rectangular or cantilevered probe cards
- Selectable eyepiece or CCD camera image navigation
Ease of Use
- Built upon the stability and maturity of Sierra Software
- Static OFI analysis: Smart defaults, automatic SLS channel selection, and easy-to-navigate GUI
- Photon Emission mode: Analysis tools such as Centroid feature, Background subtraction, Good die / Bad die analysis, Multi-tile mosaic and Live Emission mode
Laser Marker option
- Physical marking of a hotspot or fault location to enable fault redetection from EFA to PFA, without requiring the use of GDS CAD information
- Accuracy better than <2 μm
- Automated stage motion and multiple marking options
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