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Vacuum Reflow System
From Essembly Equipment
Feature: Provides quick heating and quick cooling processing works through direct heating by hot plate and special cooling mechanism so that optimal reflow conditions will be achieved. Reduces oxides of solder sheet and pad non-flux processing, with the whole stroke maintained in a H2 reduction atmosphere or anti-oxidation atmosphere to ensure excellent wettability. Eliminates voids by performing deaeration in vacuum during the process of solder melting.
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