SEC Co., Ltd
1 products found

SEC Co., Ltd products

Semiconductor Packaging System

SEC - Potting System

Specifications - Chip Size: 1 x 1 to 20 x 20 mm. Object Tape: 35 mm, 48 mm, 70 mm (Super, Wide). Tape Thickness: 0.025 mm – 0.125 mm (TCP, COF). Chip Thickness: 0.2 – 1.0 mm. Tape Material: Polyimide. Reel Outside Diameter: Max. TAB Reel Ø620 (Spacer Reel Ø530).