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HuayaoModel P Type -Silicon Wafer

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Equipping with the leading technology and facilities which allow us to produce the high-quality wafers with a variety of different sizes from G12, M10 to M6, moreover the N type wafers which ideally match the TOPCon, HJT etc. the next cell technologies.

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  • G12 (210mm) CZ 0.4-1.1 ohm.cm 155+20/-10pm
  • M10 (182mm) CZ 0.4-1.1 ohm.cm...

Customer satisfaction can only be achieved by quality and time to time services.

  • Low oxygen : 15ppm which is lower than the industry  standard
  • Thinner wafer : Thinner slicing technology to reduce the silicon cost
  • Big size ingot​​​​​​​ : Bigger ingot dimension to lower the silicon  cost of wafer
  • High lifetime​​​​​​​ : Higher than 70u which is better than the  industry standard