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TuffbondModel 317 -Epoxies for Electronic Adhesives

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Tuffbond 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.

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  • Substrates: Wood
  • Substrates: Plastic
  • Substrates: Stone
  • Substrates: Metal
  • Applications: Potting
  • Substrates: Composite
  • Specifications: USDA Approved
  • Applications: Bonding