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Tuffbond - Model 317 -Epoxies for Electronic Adhesives
Tuffbond 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent resistance. Tuffbond® 317 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components.
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- Substrates: Wood
- Substrates: Plastic
- Substrates: Stone
- Substrates: Metal
- Applications: Potting
- Substrates: Composite
- Specifications: USDA Approved
- Applications: Bonding
